Process condition dependence of mechanical and physical properties of silicon nitride thin films

Journal of Applied Physics

Volumn 102, Issue 10, 2007, Pages

  Walmsley, B A ^a   Keating, A J ^a   Liu, Y ^a   Hu, X Z ^a   Bush, M B ^a   Dell, J M ^a   Faraone, L ^a  

^a UNIVERSITY OF WESTERN AUSTRALIA   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; PHYSICAL PROPERTIES; POISSON RATIO; QUARTZ CRYSTAL MICROBALANCES; RESONANCE; SILICON NITRIDE;

MICROCANTILEVER BEAM; TORSIONAL VIBRATION;

THIN FILMS;

EID: 36649010856     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2817621     Document Type: Article

References (28)

1. M. Martyniuk, J. Antoszewski, C. A. Musca, J. M. Dell, and L. Faraone, Proc. SPIE 5276, 451 (2004).
2. K. J. Winchester and J. M. Dell, J. Micromech. Microeng. 11, 589 (2001).
3. J. Antoszewski, J. Dell, T. Shivakumar, M. Martyniuk, K. Winchester, J. Wehner, C. Musca, and L. Faraone, Proc. SPIE 4935, 148 (2002).
4. A. J. Keating, K. K. M. B. D. Silva, J. M. Dell, C. A. Musca, and L. Faraone, IEEE Photonics Technol. Lett. 18, 1079 (2006).
5. B. A. Walmsley, Y. Liu, X. Z. Hu, M. B. Bush, K. J. Winchester, M. Martyniuk, J. M. Dell, and L. Faraone, J. Appl. Phys. 98, 44904 (2005).
6. W. C. Oliver and G. M. Pharr, J. Mater. Res. 7, 1564 (1992).
7. G. Z. Sauerbrey, Z. Phys. 155, 206 (1959).
8. H.-C. Tsai and W. Fang, Sens. Actuators, A A103, 377 (2003).
9. S. Nakano, R. Maeda, and K. Yamanaka, Jpn. J. Appl. Phys., Part 1 36, 3265 (1997).
10. U. Rabe, K. Janser, and W. Arnold, Rev. Sci. Instrum. 67, 3281 (1996).
11. L. Kiesewetter, J.-M. Zhang, D. Houdeau, and A. Steckenborn, Sens. Actuators, A A35, 153 (1992).
12. C.-W. Baek, Y.-K. Kim, Y. Ahn, and Y.-H. Kim, Sens. Actuators, A A117, 17 (2005).
13. X. Y. Ye, Z. Y. Zhou, Y. Yang, J. H. Zhang, and J. Yao, Sens. Actuators, A A54, 750 (1996).
14. Y.-C. Wang, T. Hoechbauer, J. G. Swadener, A. Misra, R. G. Hoagland, and M. Nastasi, Exp. Mech. 46, 503 (2006).
15. T. Maeda, V. Baburaj, and T. Koga, Opt. Eng. 36, 1942 (1997).
16. K. J. Winchester and J. M. Dell, Proceedings of the IEEE Conference on Optoelectronic and Microelectronic Materials and Devices (COMMAD), (IEEE, New York, 2000), p. 324.
17. M. Martyniuk, " Low-Temperature Micro-Opto-Electro-Mechanical Technologies for Temperature Sensitive Substrates., " Ph.D. thesis, University of Western Australia, 2006.
18. V. Ziebart, O. Paul, U. Munch, and H. Baltes, Thin Films-Stresses and Mechanical Properties VII (Materials Research Society, Pittsburgh, 1998) in Mater. Res. Soc. Symp. Proc., Vol. 505, p. 27.
19. J. J. Vlassak and W. D. Nix, J. Mater. Res. 7, 3242 (1992).
20. W. S. Liao, C. H. Lin, and S. C. Lee, Appl. Phys. Lett. 65, 2229 (1994).
21. N. Jehanathan, B. Walmsley, Y. Liu, J. Dell, and M. Saunders, J. Appl. Phys. 100, 123516 (2006).
22. W. A. P. Claassen, W. G. J. N. Valkenburg, M. F. C. Willemsen, and W. M. van de Wijgert, J. Electrochem. Soc. 132, 893 (1985).
23. M. T. K. Soh, N. Savvides, C. A. Musca, J. M. Dell, and L. Faraone, Proc. SPIE 5276, 434 (2004).
24. CRC Handbook of Chemistry and Physics, edited by, D. R. Lide, (CRC, Boca Raton, FL, 2006), Vol. 87.
25. G. N. Parsons, J. Non-Cryst. Solids 266-269, 23 (2000).
26. N. Alexandre, M. Desmaison-Brut, F. Valin, and M. Boncoeur, J. Mater. Sci. 28, 2385 (1993).
27. T. Maruyama, T. Kaito, S. Onose, and I. Shibahara, J. Nucl. Mater. 255, 267 (1995).
28. A. Y. Artamonov, V. A. Danilenko, and Yu. A. Kashtalyan, Sov. Powder Metall. Met. Ceram 1, 33 (1964).