Development and assessment of global-local modeling technique used in advanced microelectronic packaging

EuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Volumn , Issue , 2007, Pages

  Che, F X ^a   Pang, H L J ^b   Zhu, W H ^a   Sun, Wei ^a   Sun, Anthony Y S ^a   Wang, C K ^a   Tan, H B ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROELECTRONICS; MODAL ANALYSIS; THERMAL CYCLING;

CUT BOUNDARY; EFFECTIVE STIFFNESS; GLOBAL LOCAL BEAM; SUBMODELING;

ELECTRONICS PACKAGING;

EID: 36349004194     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2007.360018     Document Type: Conference Paper

References (20)

1. th Electronics Packaging Technology Conf, Singapore, Dec. 8-10, 2004, pp. 787-792.
2. Pang, H.L.J., Chong, D.Y.R., and Low, T.H, "Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability", IEEE Transaction on Components and Packaging Technologies, Vol. 24, No.4 (2001), pp. 705-712.
3. Pang, H.L.J., and Chong, Y.R., "Flip Chip on Board Solder Joint Reliability Analysis Using 2-D and 3-D FEA Models", IEEE Transaction on Advanced Packaging, Vol.24, No.4 (2001), pp. 499-506.
4. Akay, H.U., Liu, Y., and Rassaian, M., "Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages", Journal of Electronic Packaging, Vol.125 (2003), pp. 347-353.
5. Pang, H.L.J., Seetoh, C.W., and Wang, Z.P., "CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis", Journal of Electronic Packaging, Vol. 122 (2000), pp. 255-261.
6. th Electronic Components and Technology Conf Orlando, May 29-June 1 2001, pp. 1164-1169.
7. th Electronic Components and Technology Conf, Las Vegas, May 21-24, 2000, pp. 1059-1063.
8. th Electronics Packaging Technology Conf, Singapore, Dec. 10-12, 2003, pp. 470-478.
9. Yang, Q. J., Lim, G.H., Pang, H.L.J., et al., "Vibration Reliability Analysis of a PBGA Assembly under Foundation Excitations", EEP-Vol. 26-1, Advances in Electronic Packaging, Vol. 1, ASME International Electronic Conf 1999, pp. 705-711.
10. th Electronic Components and Technology Conf San Diego, California, May 30-June 2, 2006, pp. 356-363.
11. Che, F. X., Pang, H.L.J., Zhu, W.H., Sun, W., and Sun, Y. S., "Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints", Proc Internatioanl Conf Electronic Packaging Technology, Shanghai, Aug. 27-29, 2006, pp. 155-160.
12. ANSYS Version 7.0 Manual, 2002, Ansys Inc.
13. Petyt, M., Introduction to Finite Element Vibration Analysis, Cambridge University Press, 1990.
14. th Electronic Components and Technology Conf, Florida, May 31-June 3, 2005, pp. 916-921.
15. th Electronic Components and Technology Conf, Las Vegas, Nevada, June 1-4, 2004, pp. 1055-1061.
16. th Electronics Packaging Technology Conf, Singapore, December 10-12, 2003, pp. 107-113.
17. Steinberg, Dave S., Vibration Analysis for Electronic Equipment, John Wiley & Sons (New York, 1998).
18. th Electronics Packaging Technology Conf Singapore, December 2005, pp. 868-872.
19. Pang, H.L.J., and Che, F.X., "Isothermal Cyclic Bend Fatigue Test Method For Lead Free Solder Joints", Proc 2006 Inter Society Conference on Thermal Phenomena, San Diego, California, May 30-June 2, 2006, pp. 1011-1017.
20. th Electronic Components and Technology Conf San Diego, California, May 30-June 2, 2006, pp. 443-448.