Isothermal cyclic bend fatigue test method for lead free solder joints

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1011-1017

  Pang, John H L ^a   Che, Fa Xing ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Bend test; Fatigue model; Lead free; Sn Ag Cu; Solder

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; FAILURE ANALYSIS; JOINTS (STRUCTURAL COMPONENTS); SOLDERING ALLOYS; THERMAL EFFECTS;

BEND TEST; FATIGUE MODEL; LEAD FREE SOLDER;

FATIGUE OF MATERIALS;

EID: 33845590409     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645455     Document Type: Conference Paper

References (8)

1. S. Shetty et al., "Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending", Journal of Electronic Packaging, Vol. 123, pp. 302-308, 2001.
2. S. Shetty and T. Reinikainen, "Three- and Four-Point Bend Testing for Electronic Packages", Journal of Electronic Packaging, Vol. 125, pp. 556-561, 2003.
3. th Electronic Components and Technology Conference, June 1-4, Las Vegas, pp. 1279-1287, 2004.
4. nd Electronic Components and Technology Conference, pp. 974-978, 2002.
5. JEDEC Standard, JESD22-B111: Board Level Drop Test Method of Components for Handheld Electronic Products, 2003.
6. JEDEC Standard, IPC/JEDEC-9702: Monotonic Bend Characterization of Board-Level Interconnects, 2004.
7. th Electronics Packaging Technology Conference, December 8-10, Singapore, pp. 787-792, 2004.
8. st Electronic Components and Technology Conference, pp. 606-612, 2001.