Vibration fatigue analysis for FCOB solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 1055-1061

  Pang, John H L ^a   Che, F X ^a   Low, T H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC ASSEMBLIES; FLIP CHIP ON BOARD (FCOB); HARMONIC MOTION; PLASTIC STRAINS;

ACCELEROMETERS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HIGH SPEED CAMERAS; MATERIALS TESTING; MATHEMATICAL MODELS; RELIABILITY; VIBRATIONS (MECHANICAL); WEIBULL DISTRIBUTION;

SOLDERED JOINTS;

EID: 10444265877     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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