Study of non-preston phenomena induced from the passivated additives in copper CMP

Journal of the Electrochemical Society

Volumn 154, Issue 1, 2007, Pages

  Chen, Kei Wei ^a   Wang, Ying Lang ^a,b  

^a NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

^b NATIONAL CHIAYI UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ETCHING; NANOTECHNOLOGY; SURFACE STRUCTURE;

CHEMICAL MECHANICAL PLANARIZATION (CMP); OXIDIZER CONCENTRATIONS; POTENTIODYNAMIC METHODS; SEQUENTIAL STACKED FILMS;

COPPER;

EID: 33845262443     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2374942     Document Type: Article

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