The formation and evolution of IMC and its effect on the solder joint properties

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Li, Xiao Yan ^a   Wu, Ben Sheng ^b   Yang, Xiao Hua ^b  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b FUZHOU UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; EUTECTICS; GIBBS FREE ENERGY; INTERFACES (MATERIALS); SILVER ALLOYS; SOLDERED JOINTS; THERMODYNAMICS;

DIFFUSION KINETICS; EUTECTIC SOLDER ALLOYS; SOLDER JOINT PROPERTIES; SOLDER PAD INTERFACES;

INTERMETALLICS;

EID: 33846296591     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564664     Document Type: Conference Paper

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