Segregation of organic impurities in thin electroplated Cu metallizations

Microchimica Acta

Volumn 156, Issue 1-2, 2006, Pages 159-162

  Stangl, Marcel ^a   Acker, Jörg ^a   Hoffmann, Volker ^a   Gruner, Wolfgang ^a   Wetzig, Klaus ^a  

^a IFW DRESDEN   (Germany)

Author keywords

Copper; Electrochemical deposition; GD OES; Impurities; Segregation

Indexed keywords

EID: 33751414814     PISSN: 00263672     EISSN: 14365073     Source Type: Journal    
DOI: 10.1007/s00604-006-0606-x     Document Type: Conference Paper

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