Low viscosity and fast curing polymer system for UV-based nanoimprint lithography and its processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6517, Issue PART 2, 2007, Pages

  Vogler, Marko ^a   Bender, Markus ^b   Plachetka, Ulrich ^b   Fuchs, Andreas ^b   Wiedenberg, Sabine ^a   Reuther, Freimut ^a   Grützner, Gabi ^a   Kurz, Heinrich ^b  

^a MICRO RESIST TECHNOLOGY GMBH   (Germany)

^b AMO GMBH   (Germany)

Author keywords

Material design; Photoinitiator; Resist; UV curable polymer; UV NIL

Indexed keywords

FILM THICKNESS; PHOTORESISTS; SPIN COATING; VISCOSITY;

UV-BASED NANOIMPRINT LITHOGRAPHY; UV-CURABLE POLYMERS; WAFER SCALE IMPRINTING;

NANOIMPRINT LITHOGRAPHY;

LITHOGRAPHY; PHOTOINITIATORS; THIN FILMS;

EID: 35148832583     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.708507     Document Type: Conference Paper

References (22)

1. S.Y. Chou, P.R. Krauss, P.J. Renstrom, J. Vac. Sci. Technol. B14 (1996), 4129;
2. Review on resists and polymers e.g. F. Reuther, J. Photopolym. Sci. Technol. 18 (2005), 525.
3. J. Haisma, M. Verheijen, K. van den Heuvel, J. van den Berg, J. Vac. Sci. Technol. B14 (1996), 4124.
4. M. Bender, A. Fuchs, U. Plachetka, H. Kurz, Microel.Eng. 83 (2006), 827.
5. M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M. Wedlake, T. Michaelson, S. V. Sreenivasan, J. Ekerdt, and C. G. Willson, Proc. SPIE 3676 (1999), 379.
6. M. Bender, B. Hadam, B. Spangenberg, H. Kurz, Microel. Eng. 61 (2002), 407;
7. M. Bender, U. Plachetka, J. Ran, A. Fuchs, B. Vratzov, H. Kurz, T. Glinsner, F. Lindner, J. Vac. Sci. Technol. B22 (2004), 3229;
8. G.Y. Jung, S. Ganapathiappan, D.A.A. Ohlberg, D.L. Olynick, Y. Chen, W.M. Tong, R.S. Williams, Nano Lett. 4 (2004), 1225;
9. M.D. Stewart, C.G. Willson, MRS Bull. 30 (2005), 947.
10. H. Schift, L.J. Heydermann, Nanorheology, in: C.M. Sotomayor Torres (ed.), Alternative lithography, Kluwer, 2003, p.57.
11. M. Otto, M. Bender, F. Richter, B. Hadam, T. Kliem, R. Jede, B. Spangenberg, H. Kurz, Microel. Eng. 73-74 (2004), 152.
12. M. Vogler, S. Wiedenberg, M. Mühlberger, I. Bergmair, T. Glinsner, H. Schmidt, E.-B. Kley, G. Grützner, Microel. Eng. (2007), accepted for publication.
13. M. P. Patel, M. Braden, K.W. Davy, Biomaterials 8 (1987), 53.
14. R. L. Burns, S.C. Johnson, G.M. Schmid, E.K. Kim, M.D. Dickey, J. Meiring, S.D. Burns, N.A. Stacey, C.G. Willson, Proc. SPIE 5374 (2004), 348.
15. K. Studer, C. Decker, E. Beck, and R. Schwalm, Prog. Org. Coat. 48 (2003), 92;
16. K. Studer, C Decker, E. Beck, and R. Schwalm, Prog. Org. Coat. 48 (2003), 101.
17. Irgacure is brand name of Ciba Specialty chemicals
18. T. Y. Lee, C. A. Guymon, E. S. Jönsson, and C E. Hoyle, Polymer 45 (2004), 6155.
19. M. Beck, M. Graczyk, I. Maximov, E.-L. Sarwe, T.G.I. Ling, M. Keil, L. Montelius, Microel. Eng. 61-62 (2002), 441.
20. Adhesion promoter TI Prime was used. It is commercially available from MicroChemicals GmbH (Germany).
21. 8.
22. ICP-RIE processes were applied in [8].