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Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5376, Issue PART 2, 2004, Pages 697-702

Design and development of high etch rate organic bottom antireflective coating for sub-100 nm node and beyond

(8) Wu, Hengpeng a Xiang, Zhong a Hishida, Aritaka a Abdallah, David a Shan, Jianhui a Gonzalez, Eleazar a Ding, Shuji a Neisser, Mark a

a CLARIANT CORPORATION (United States)

Author keywords

193 nm; Bottom antireflective coating; Etch rate; Photolithography

Indexed keywords

193 NM; BOTTOM ANTI-REFLECTIVE COATINGS (BARC); ETCH RATE; THERMOSETTING;

ADDITIVES; CROSSLINKING; DISSOLUTION; ELLIPSOMETRY; ETCHING; INTEGRATED CIRCUITS; OPTIMIZATION; ORGANIC SOLVENTS; PARAMETER ESTIMATION; PHOTOLITHOGRAPHY; POLYMERIZATION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

ANTIREFLECTION COATINGS;

EID: 3843147181 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.537883 Document Type: Conference Paper

Times cited : (5)

References (6)

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3
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.