Electropotential-stimulated wear of copper during chemical mechanical planarization

Wear

Volumn 263, Issue 7-12 SPEC. ISS., 2007, Pages 1470-1476

  Kulkarni, Milind ^a   Ng, Dedy ^a   Baker, Melloy ^a   Liang, Hong ^a   Her, Robert ^b  

^a TEXAS A AND M UNIVERSITY   (United States)

^b Ferro Incorporated   (United States)

Author keywords

Atomic force microscope (AFM); Cu CMP; Electrochemical and mechanical wear; Electrochemical mechanical polishing; Pulsating current; Surface roughness

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTIONS; COPPER; IONS; SURFACE PROPERTIES; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

CATHODIC POTENTIALS; CHEMICAL WEAR PROCESS;

WEAR OF MATERIALS;

CHEMICAL MECHANICAL POLISHING; CHEMICAL REACTIONS; COPPER; IONS; SURFACE PROPERTIES; SURFACE ROUGHNESS; WEAR OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 34548017675     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2006.12.028     Document Type: Article

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