Influence of oxides on friction during Cu CMP

Journal of Electronic Materials

Volumn 30, Issue 4, 2001, Pages 391-395

  Liang, Hong ^a   Martin, Jean Michel ^b  

^a University of Alaska Fairbanks   (United States)

^b ECOLE CENTRALE DE LYON   (France)

Author keywords

Cu CMP; Cu oxidation; Cu passivation; Electrochemistry of Cu; Nano abrasive particles; Tribology

Indexed keywords

COPPER; DEFECTS; ELECTROCHEMISTRY; FIELD EMISSION DISPLAYS; FRICTION; OXIDES; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SILICA; TRANSMISSION ELECTRON MICROSCOPY; TRIBOLOGY; X RAY SPECTROSCOPY;

NANO-ABRASIVE PARTICLES;

CHEMICAL MECHANICAL POLISHING;

EID: 0035304031     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0049-4     Document Type: Article

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