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Journal of Electronic Materials
Volumn 31, Issue 4, 2002, Pages 272-277
Effects of electric potential on chemical-mechanical polishing of copper
(2)
Helen Xu, G
a
Liang, Hong
a
a
University of Alaska Fairbanks
(
United States
)
Author keywords
Cu CMP; Electric potential; Planarization
Indexed keywords
CHEMICAL MECHANICAL POLISHING; ELECTRIC POTENTIAL; MORPHOLOGY; PH EFFECTS; SLURRIES;
PLANARIZATION;
COPPER;
EID
:
0036540815
PISSN
:
03615235
EISSN
:
None
Source Type
:
Journal
DOI
:
10.1007/s11664-002-0143-2
Document Type
:
Article
Times cited : (
19
)
References (
21
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.
