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Scripta Materialia
Volumn 46, Issue 5, 2002, Pages 343-347
Lubricating behavior in chemical-mechanical polishing of copper
(2)
Liang, Hong
a
Helen Xu, G
a
a
University of Alaska Fairbanks
(
United States
)
Author keywords
Copper; Oxides; Semiconductors; Surface; Wear
Indexed keywords
CHEMICAL MECHANICAL POLISHING; COMPUTER SIMULATION; COPPER OXIDES; LUBRICATION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS; WEAR OF MATERIALS;
HYDRODYNAMIC LUBRICATIONS;
COPPER;
EID
:
0036499352
PISSN
:
13596462
EISSN
:
None
Source Type
:
Journal
DOI
:
10.1016/S1359-6462(01)01249-0
Document Type
:
Article
Times cited : (
52
)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.
