Electrochemical planarization of patterned copper films for microelectronic applications

Journal of Materials Engineering and Performance

Volumn 13, Issue 4, 2004, Pages 413-420

  Huo, J ^a   Solanki, R ^b   McAndrew, J ^a  

^a Electronics R and D Group   (United States)

^b OREGON HEALTH AND SCIENCE UNIVERSITY   (United States)

Author keywords

Chemical mechanical polishing (CMP); Cu; Cu film; Cu interconnect; Electrochemical planarization; Electrochemical polishing (ECP); Electropolishing; Electropolishing mechanism; Polarization curve

Indexed keywords

COPPER FILMS; COPPER INTERCONNECT; ELECTROCHEMICAL PLANARIZATION; ELECTROPOLISHING MECHANISM; POLARIZATION CURVE;

ADDITIVES; CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROLYTIC POLISHING; ELECTROPLATING; GLYCOLS; MICROELECTRONICS; PHOSPHORIC ACID; SILICON WAFERS; SODIUM CHLORIDE; SOLUTIONS; SULFURIC ACID;

THIN FILMS;

EID: 4344587764     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/10599490419964     Document Type: Conference Paper

References (12)

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