The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 2, 2003, Pages 106-109

  Yung, K C ^a   Yue, T M ^a   Chan, K C ^a   Yeung, K F ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Microvia; Printed circuit boards; Pulse plating; Throwing power; Vibration

Indexed keywords

ANODES; CATHODES; COPPER PLATING; ELECTRIC CURRENTS; LASER APPLICATIONS; NEGATIVE IONS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; SULFURIC ACID;

ACID COPPER SULPHATE BATH; CHLORIDE ION; COPPER SULPHATE; LASER PROCESSING SYSTEM; MICROVIA; PULSE PLATING; THROWING POWER;

ELECTRONICS PACKAGING;

EID: 0242333980     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.817722     Document Type: Article

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