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Volumn 31, Issue 8, 2002, Pages 872-878

Interfacial transfer between copper and polyurethane in chemical-mechanical polishing

Author keywords

Cu CMP; Cu oxidation; Cu passivation; Electrochemistry of Cu; Friction stimulated chemical wear; Nanoabrasive particles; Tribology

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; BINDING ENERGY; CHEMICAL BONDS; COPPER; FRICTION; INTERFACES (MATERIALS); KINETIC ENERGY; PASSIVATION; POLYURETHANES; REMOVAL; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0036688622     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0198-0     Document Type: Article
Times cited : (27)

References (28)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.