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Volumn 31, Issue 8, 2002, Pages 872-878
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Interfacial transfer between copper and polyurethane in chemical-mechanical polishing
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Author keywords
Cu CMP; Cu oxidation; Cu passivation; Electrochemistry of Cu; Friction stimulated chemical wear; Nanoabrasive particles; Tribology
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Indexed keywords
AUGER ELECTRON SPECTROSCOPY;
BINDING ENERGY;
CHEMICAL BONDS;
COPPER;
FRICTION;
INTERFACES (MATERIALS);
KINETIC ENERGY;
PASSIVATION;
POLYURETHANES;
REMOVAL;
SCANNING ELECTRON MICROSCOPY;
X RAY PHOTOELECTRON SPECTROSCOPY;
INTERFACIAL TRANSFER;
POLISHING PADS;
CHEMICAL MECHANICAL POLISHING;
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EID: 0036688622
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-002-0198-0 Document Type: Article |
Times cited : (27)
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References (28)
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