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Volumn 20, Issue 3, 2007, Pages 306-312

In Situ endpoint detection by acoustic emissions in chemical-mechanical polishing of metal overlay

Author keywords

Acoustic emission; Chemical mechanical polishing (CMP); Copper overlay; Endpoint detection; Pad; Thermal monitoring

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRIC POWER SYSTEM INTERCONNECTION; INTEGRATED CIRCUIT LAYOUT; LITHOGRAPHY; SILICON WAFERS;

EID: 34547768038     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2007.901406     Document Type: Conference Paper
Times cited : (15)

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