-
2
-
-
0035124634
-
Essential aspects in chemical mechanical planarization of dioxide semiconductor
-
Bonn, Switzerland: Trans Tech
-
H. Hocheng, H. Y. Tsai, and Y. L. Huang, "Essential aspects in chemical mechanical planarization of dioxide semiconductor," in Key Engineering Materials. Bonn, Switzerland: Trans Tech, 2001, pp. 1-24.
-
(2001)
Key Engineering Materials
, pp. 1-24
-
-
Hocheng, H.1
Tsai, H.Y.2
Huang, Y.L.3
-
3
-
-
0017730644
-
An application of acoustic emission to in-process sensing of tool-wear
-
K. Iwata and T. Moriwaki, "An application of acoustic emission to in-process sensing of tool-wear," Ann. CIRP, vol. 26, pp. 21-32, 1977.
-
(1977)
Ann. CIRP
, vol.26
, pp. 21-32
-
-
Iwata, K.1
Moriwaki, T.2
-
5
-
-
0021371007
-
An investigation of grinding and wheel loading using acoustic emission
-
D. A. Dornfeld and H. G. Cai, "An investigation of grinding and wheel loading using acoustic emission," ASME Trans. J. Eng. Industry, vol. 106, pp. 28-33, 1984.
-
(1984)
ASME Trans. J. Eng. Industry
, vol.106
, pp. 28-33
-
-
Dornfeld, D.A.1
Cai, H.G.2
-
6
-
-
0025902479
-
Monitoring and optimization of internal grinding process
-
I. Inasaki, "Monitoring and optimization of internal grinding process," Ann. CIRP, vol. 40, pp. 359-362, 1991.
-
(1991)
Ann. CIRP
, vol.40
, pp. 359-362
-
-
Inasaki, I.1
-
7
-
-
0019138964
-
Acoustic emission during orthogonal metal cutting
-
D. A. Dornfeld and E. Kannatey-Asibu, "Acoustic emission during orthogonal metal cutting," Int. J. Mechanical Sci., vol. 22, pp. 285-296, 1980.
-
(1980)
Int. J. Mechanical Sci
, vol.22
, pp. 285-296
-
-
Dornfeld, D.A.1
Kannatey-Asibu, E.2
-
8
-
-
0019602011
-
Quantitative relationships for acoustic emission from, orthogonal metal cutting
-
E. Kannatey-Asibu and D. A. Dornfeld, "Quantitative relationships for acoustic emission from, orthogonal metal cutting," ASME Trans. J. Eng. Industry, vol. 103, pp. 330-340, 1981.
-
(1981)
ASME Trans. J. Eng. Industry
, vol.103
, pp. 330-340
-
-
Kannatey-Asibu, E.1
Dornfeld, D.A.2
-
9
-
-
0029708790
-
An investigation of the AE signals in the lapping process
-
Y. P. Chang, M. Hashimura, and D. A. Dornfeld, "An investigation of the AE signals in the lapping process," Ann. CIRP, vol. 45, pp. 331-334, 1996.
-
(1996)
Ann. CIRP
, vol.45
, pp. 331-334
-
-
Chang, Y.P.1
Hashimura, M.2
Dornfeld, D.A.3
-
10
-
-
0029493281
-
In situ CMP monitoring technique for multi-layer interconnection
-
A. Fukuroda, K. Nakamura, and Y. Arimoto, "In situ CMP monitoring technique for multi-layer interconnection," in Proc. Technical Dig. Int. Electron Devices Meeting, 1995, pp. 469-472.
-
(1995)
Proc. Technical Dig. Int. Electron Devices Meeting
, pp. 469-472
-
-
Fukuroda, A.1
Nakamura, K.2
Arimoto, Y.3
-
11
-
-
0031364207
-
Low-K dielectric material chemical mechanical polishing process monitoring using acoustic emission
-
J. S. Tang, C. Unger, Y. Moon, and D. Dornfeld, "Low-K dielectric material chemical mechanical polishing process monitoring using acoustic emission," Proc. Material Res. Soc Symp., vol. 476, pp. 115-160, 1997.
-
(1997)
Proc. Material Res. Soc Symp
, vol.476
, pp. 115-160
-
-
Tang, J.S.1
Unger, C.2
Moon, Y.3
Dornfeld, D.4
-
12
-
-
0032182798
-
In-process detection of microscratching during CMP using acoustic emission sensing technology
-
J. S. Tang, D. Dornfeld, S. K. Pangrle, and A. Dangca, "In-process detection of microscratching during CMP using acoustic emission sensing technology," J. Electron. Mater., vol. 27, no. 10, pp. 1099-1103, 1998.
-
(1998)
J. Electron. Mater
, vol.27
, Issue.10
, pp. 1099-1103
-
-
Tang, J.S.1
Dornfeld, D.2
Pangrle, S.K.3
Dangca, A.4
-
13
-
-
0033310280
-
In-line monitoring of chemical mechanical polishing processes
-
Int. Soc. Optical Eng
-
D. L. Hetherington and D. J. Stein, "In-line monitoring of chemical mechanical polishing processes," Proc. SPIE, vol. 3884, pp. 24-35, 1999, Int. Soc. Optical Eng..
-
(1999)
Proc. SPIE
, vol.3884
, pp. 24-35
-
-
Hetherington, D.L.1
Stein, D.J.2
-
14
-
-
0034247165
-
Application of CMP process monitor to Cu polishing
-
Aug
-
T. Kojima, M. Miyajima, F. Akaboshi, T. Yogo, S. Ishimoto, and A. Okuda, "Application of CMP process monitor to Cu polishing," IEEE Trans. Semicond. Manuf., vol. 13, no. 3, pp. 293-299, Aug. 2000.
-
(2000)
IEEE Trans. Semicond. Manuf
, vol.13
, Issue.3
, pp. 293-299
-
-
Kojima, T.1
Miyajima, M.2
Akaboshi, F.3
Yogo, T.4
Ishimoto, S.5
Okuda, A.6
-
15
-
-
0002225444
-
An ultrasonic laser sonar technique for copper damascene CMP metrology
-
M. Colgan, C. Morath, G. Tas, and M. Grief, "An ultrasonic laser sonar technique for copper damascene CMP metrology," Solid State Technol., vol. 44, no. 2, pp. 67-74, 2001.
-
(2001)
Solid State Technol
, vol.44
, Issue.2
, pp. 67-74
-
-
Colgan, M.1
Morath, C.2
Tas, G.3
Grief, M.4
-
16
-
-
34547784950
-
Use of acoustic spectral analysis for monitoring/control of CMP process,
-
U.S. Patent 6424137
-
R. K. Sampson, "Use of acoustic spectral analysis for monitoring/control of CMP process," U.S. Patent 6424137, 2002.
-
(2002)
-
-
Sampson, R.K.1
-
17
-
-
0036499352
-
Lubricating behavior in chemical-mechanical polishing of copper
-
H. Liang and G. H. Xu, "Lubricating behavior in chemical-mechanical polishing of copper," Scripta Materiala, vol. 46, pp. 343-347, 2002.
-
(2002)
Scripta Materiala
, vol.46
, pp. 343-347
-
-
Liang, H.1
Xu, G.H.2
-
18
-
-
0035737991
-
Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process
-
A. K. Sikder, F. Giglio, F. Wood, A. Kumar, and M. Anthony, "Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process," J. Electron. Mater., vol. 30, no. 12, pp. 1520-1626, 2001.
-
(2001)
J. Electron. Mater
, vol.30
, Issue.12
, pp. 1520-1626
-
-
Sikder, A.K.1
Giglio, F.2
Wood, F.3
Kumar, A.4
Anthony, M.5
-
19
-
-
0033329453
-
Kinematic analysis and measurement of temperature rise on a pad in chemical mechanical planarization
-
H. Hocheng, Y. L. Huang, and L. J. Chen, "Kinematic analysis and measurement of temperature rise on a pad in chemical mechanical planarization," J. Electrochemical Soc., vol. 146, no. 11, pp. 4236-4239, 1999.
-
(1999)
J. Electrochemical Soc
, vol.146
, Issue.11
, pp. 4236-4239
-
-
Hocheng, H.1
Huang, Y.L.2
Chen, L.J.3
-
20
-
-
34547759713
-
Preliminary study of endpoint detection for chemical mechanical planarization process using acoustic emission
-
H. Hocheng and Y.-L. Huang, "Preliminary study of endpoint detection for chemical mechanical planarization process using acoustic emission," Proc. 18th Int. VLSI Multilevel Interconnection Conf., pp. 107-109, 2001.
-
(2001)
Proc. 18th Int. VLSI Multilevel Interconnection Conf
, pp. 107-109
-
-
Hocheng, H.1
Huang, Y.-L.2
-
21
-
-
2642558706
-
In-Situ endpoint detection by pad temperature in chemical mechanical polishing of copper overlay
-
May
-
H. Hocheng and Y. L. Huang, "In-Situ endpoint detection by pad temperature in chemical mechanical polishing of copper overlay," IEEE Trans. Semicond. Manuf., vol. 17, no. 2, pp. 180-187, May 2004.
-
(2004)
IEEE Trans. Semicond. Manuf
, vol.17
, Issue.2
, pp. 180-187
-
-
Hocheng, H.1
Huang, Y.L.2
-
22
-
-
0000433353
-
Nondestructive Testing Handbook
-
Columbus, OH: American Society for Nondestructive Testing
-
R. K. Miller and P. Mclentire, Nondestructive Testing Handbook, ser. Acoustic Emission Testing. Columbus, OH: American Society for Nondestructive Testing, 1987, vol. 5.
-
(1987)
ser. Acoustic Emission Testing
, vol.5
-
-
Miller, R.K.1
Mclentire, P.2
-
23
-
-
0001611894
-
The theory and design of plate glass polishing
-
F. W. Preston, "The theory and design of plate glass polishing," J. Soc. Glass Technol., vol. 11, pp. 214-256, 1927.
-
(1927)
J. Soc. Glass Technol
, vol.11
, pp. 214-256
-
-
Preston, F.W.1
-
24
-
-
0033333130
-
Improved metal CMP endpoint control by monitoring carrier speed controller output or pad temperature
-
P. J. Beckage, R. Lukner, W. Cho, K. Edwards, M. Jester, and S. Shaw, "Improved metal CMP endpoint control by monitoring carrier speed controller output or pad temperature," Proc. SPIE, vol. 3882, pp. 118-125, 1999.
-
(1999)
Proc. SPIE
, vol.3882
, pp. 118-125
-
-
Beckage, P.J.1
Lukner, R.2
Cho, W.3
Edwards, K.4
Jester, M.5
Shaw, S.6
-
25
-
-
0012081983
-
A history of acoustic emission
-
T. F. Drouillard, "A history of acoustic emission," J. Acoustic Emission, vol. 14, no. 1, pp. 1-34, 1996.
-
(1996)
J. Acoustic Emission
, vol.14
, Issue.1
, pp. 1-34
-
-
Drouillard, T.F.1
-
26
-
-
0031269840
-
W-CMP process integration: Consumables evaluation electrical results and endpoint detection
-
M. Fayolle, E. Sicurani, and Y. Morand, "W-CMP process integration: Consumables evaluation electrical results and endpoint detection," Microelectronic Eng., vol. 37-38, pp. 347-352, 1997.
-
(1997)
Microelectronic Eng
, vol.37-38
, pp. 347-352
-
-
Fayolle, M.1
Sicurani, E.2
Morand, Y.3
-
27
-
-
0017527649
-
The measurement and significance of energy in acoustic emission testing
-
D. O. Harris and R. Bell, "The measurement and significance of energy in acoustic emission testing," Experiment Mechanics, vol. 17, no. 9, pp. 347-353, 1977.
-
(1977)
Experiment Mechanics
, vol.17
, Issue.9
, pp. 347-353
-
-
Harris, D.O.1
Bell, R.2
-
28
-
-
0003862481
-
Study of tungsten CMP endpoint window
-
Z.-H. Lin, H.-W. Chiou, S.-Y. Shih, L.-H. Kuo, L.-J. Chen, and C. Hsia, "Study of tungsten CMP endpoint window," Proc. CMP-MIC, pp. 65-68, 1999.
-
(1999)
Proc. CMP-MIC
, pp. 65-68
-
-
Lin, Z.-H.1
Chiou, H.-W.2
Shih, S.-Y.3
Kuo, L.-H.4
Chen, L.-J.5
Hsia, C.6
-
29
-
-
5344250951
-
-
H. E. Litvak and H. M. Tzeng, Implementing real-time endpoint control in CMP, Semicond. Int., 19, no. 8, pp. 259, 262-260, 264, 1996.
-
H. E. Litvak and H. M. Tzeng, "Implementing real-time endpoint control in CMP," Semicond. Int., vol. 19, no. 8, pp. 259, 262-260, 264, 1996.
-
-
-
-
30
-
-
0025813691
-
A study of acoustic emission generated during orthogonal metal cutting-1: Energy analysis
-
S. Rangwala and D. Dornfeld, "A study of acoustic emission generated during orthogonal metal cutting-1: Energy analysis," Int. J. Mechanical Sci., vol. 33, no. 6, pp. 471-487, 1991.
-
(1991)
Int. J. Mechanical Sci
, vol.33
, Issue.6
, pp. 471-487
-
-
Rangwala, S.1
Dornfeld, D.2
-
31
-
-
0025723803
-
A study of acoustic emission generated during orthogonal metal cutting-2: Spectral analysis
-
S. Rangwala and D. Dornfeld, "A study of acoustic emission generated during orthogonal metal cutting-2: Spectral analysis," Int. J. Mechanical Science, vol. 33, no. 6, pp. 489-499, 1991.
-
(1991)
Int. J. Mechanical Science
, vol.33
, Issue.6
, pp. 489-499
-
-
Rangwala, S.1
Dornfeld, D.2
-
32
-
-
0037538842
-
W-CMP consumables evaluation - Electrical results and endpoint detection
-
E. Sicurani, M. Fayolle, Y. Gobil, Y. Morand, and F. Tardif, "W-CMP consumables evaluation - Electrical results and endpoint detection," Proc. Advanced Metallization and Interconnect Systems for ULSI Applications, pp. 561-566, 1996.
-
(1996)
Proc. Advanced Metallization and Interconnect Systems for ULSI Applications
, pp. 561-566
-
-
Sicurani, E.1
Fayolle, M.2
Gobil, Y.3
Morand, Y.4
Tardif, F.5
-
33
-
-
0003813794
-
Dependence of wafer carrier motor current and polish pad surface temperature signal on CMP consumable conditions and Ti/TiN liner deposition parameters for tungsten CMP endpoint detection
-
G. Springer, "Dependence of wafer carrier motor current and polish pad surface temperature signal on CMP consumable conditions and Ti/TiN liner deposition parameters for tungsten CMP endpoint detection," Proc. CMP- MIC, pp. 45-51, 1999.
-
(1999)
Proc. CMP- MIC
, pp. 45-51
-
-
Springer, G.1
-
34
-
-
0032644065
-
Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements
-
D. J. Stein and D. L. Hetherington, "Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements," Proc. SPIE, vol. 3743, pp. 112-119, 1999.
-
(1999)
Proc. SPIE
, vol.3743
, pp. 112-119
-
-
Stein, D.J.1
Hetherington, D.L.2
-
35
-
-
0033746657
-
Tungsten, chemical mechanical polishing endpoint detection
-
L. Sue, J. Lutzen, S. Gonzales, F. Wertsching, and R. Golzarian, "Tungsten, chemical mechanical polishing endpoint detection," MRS Proc., vol. 566, pp. 109-114, 1999.
-
(1999)
MRS Proc
, vol.566
, pp. 109-114
-
-
Sue, L.1
Lutzen, J.2
Gonzales, S.3
Wertsching, F.4
Golzarian, R.5
-
36
-
-
0029513786
-
-
F. Sugimoto, Y. Arimoto, and T. Ito, Simultaneous temperature measurement of wafers in chemical mechanical polishing of silicon dioxide layers, Japanese J. Appl. Physics Part 1 - Regular Papers, 34, no. 12A, pp. 6314-6320, 1995.
-
F. Sugimoto, Y. Arimoto, and T. Ito, "Simultaneous temperature measurement of wafers in chemical mechanical polishing of silicon dioxide layers," Japanese J. Appl. Physics Part 1 - Regular Papers, vol. 34, no. 12A, pp. 6314-6320, 1995.
-
-
-
-
37
-
-
0031673133
-
The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection
-
Y. L. Wang, C. Liu, M. S. Feng, and W. T. Tseng, "The exothermic reaction and temperature measurement for tungsten CMP technology and its application on endpoint detection," Mater. Chemistry Phys., vol. 52, no. 1, pp. 17-22, 1998.
-
(1998)
Mater. Chemistry Phys
, vol.52
, Issue.1
, pp. 17-22
-
-
Wang, Y.L.1
Liu, C.2
Feng, M.S.3
Tseng, W.T.4
-
38
-
-
0037399341
-
Characterization and modeling of dynamic thermal behavior in chemical mechanical planarization
-
D. White, J. Melvin, and D. Boning, "Characterization and modeling of dynamic thermal behavior in chemical mechanical planarization," J. Electrochemical Soc., vol. 150, no. 4, pp. G271-G278, 2003.
-
(2003)
J. Electrochemical Soc
, vol.150
, Issue.4
-
-
White, D.1
Melvin, J.2
Boning, D.3
-
39
-
-
34547790184
-
Acoustically regulated polishing process,
-
U.S. Patent 5399234
-
C. C. Yu, T.-K. Yu, and J. L. Klein, "Acoustically regulated polishing process," U.S. Patent 5399234, 1995.
-
(1995)
-
-
Yu, C.C.1
Yu, T.-K.2
Klein, J.L.3
|