Improved metal CMP endpoint control by monitoring carrier speed controller output or pad temperature

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3882, Issue , 1999, Pages 118-125

  Beckage, Peter J ^a   Lukner, Ralf ^a   Cho, Wonhui ^a   Edwards, Keith ^a   Jester, Michael ^a   Shaw, Stephen ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CHEMICAL POLISHING; DIGITAL FILTERS; DIGITAL SIGNAL PROCESSING; FAILURE ANALYSIS; INFRARED DETECTORS; SILICON WAFERS; TUNGSTEN;

CARRIER SPEED CONTROLLER OUTPUT SIGNAL PROCESSING; ENDPOINT DETECTION; METAL CHEMICAL MECHANICAL POLISH; TUNGSTEN CHEMICAL MECHANICAL POLISH;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033333130     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.361299     Document Type: Conference Paper

References (0)