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Volumn 3884, Issue , 1999, Pages 24-35
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In-line monitoring of chemical-mechanical polishing processes
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL POLISHING;
FRICTION;
INTERFEROMETRY;
MONITORING;
OPTICAL SENSORS;
PROCESS CONTROL;
THERMAL EFFECTS;
THICKNESS MEASUREMENT;
VIBRATION MEASUREMENT;
CHEMICAL MECHANICAL POLISHING;
ENDPOINT;
IN LINE MONITORING;
MOTOR TORQUE SENSING TECHNIQUE;
PAD TEMPERATURE SENSING TECHNIQUE;
PLANARIZATION;
VIBRATION SENSING SYSTEM;
MICROELECTRONIC PROCESSING;
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EID: 0033310280
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (37)
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