Low-k dielectric material chemical mechanical polishing process monitoring using acoustic emission

Materials Research Society Symposium - Proceedings

Volumn 476, Issue , 1997, Pages 155-160

  Tang, Jianshe ^a   Unger, Carsten ^a   Moon, Yongsik ^a   Dornfeld, David ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSIONS; CHEMICAL POLISHING; LAPPING; PARTICLE SIZE ANALYSIS; SLURRIES; SURFACE ROUGHNESS; TRIBOLOGY; WEAR OF MATERIALS;

ACOUSTIC EMISSION SENSING TECHNOLOGY; CHEMICAL MECHANICAL POLISHING;

DIELECTRIC FILMS;

EID: 0031364207     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-476-155     Document Type: Conference Paper

References (11)