An ultrasonic laser sonar technique for copper damascene CMP metrology

Solid State Technology

Volumn 44, Issue 2 SUPPL., 2001, Pages 67-74

  Colgan, Michael ^a,c   Morath, Chris ^a,c   Tas, Guray ^a,c   Grief, Malcolm ^b  

^a RUDOLPH TECHNOLOGIES INC   (United States)

^b SpeedFam IPEC   (United States)

^c Rudolph Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002225444     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. A.E. Braun, "Copper Moves CMP to Center Stage," Semiconductor International, Vol. 22, No. 14, pp. 54-62, Dec. 1999.
2. L. Yang, "Modeling CMP Copper for Dual Damascene Interconnects," Solid State Technology, Vol. 43, No. 6, pp. 111-121, June 2000.
3. D.S. DeBear, J.A. Levert, S.P. Mukherjee, "Spinetch Planarization for Dual Damascene Interconnect Structures," Solid State Technology, Vol. 43, No. 3, pp. 53-60, March 2000.
4. C.J. Morath, G.J. Collins, R.G. Wolf, R.J. Stoner, "Ultrasonic Multilayer Metal Film Metrology," Solid State Technology, Vol. 40, No. 6, pp. 85-92, June 1997.
5. G.J. Collins, "Measuring and Characterizing Opaque Multilayer Metal Film Stacks on Product Wafers," MICRO, Vol. 18, No. 6, pp. 93-106, June 2000.
6. J.M.E. Harper, et al., "Microstructural Analysis of Copper Interconnects using Picosecond Ultrasonics," MRS Proceedings, Vol. 612, Materials Research Society, Warrendale, PA, 2000.