Electroless nickel plating on patterned catalytic surfaces by electron beam lithography

Thin Solid Films

Volumn 515, Issue 20-21, 2007, Pages 7798-7804

  Lee, Jae Young ^a   Horiuchi, Shin ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Electroless plating; Electron beam lithography; Nickel; Palladium; Patterning

Indexed keywords

CATALYSTS; ELECTROLESS PLATING; ELECTRON BEAM LITHOGRAPHY; NICKEL ALLOYS; PALLADIUM; POLYMETHYL METHACRYLATES;

METALLIC SURFACE PATTERNS; PATTERN SIZES; PATTERNED CATALYTIC SURFACES;

THIN FILMS;

EID: 34547657152     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.03.188     Document Type: Article

References (25)

1. Chou S.Y., Wei M.S., Krauss P.R., and Fischer P.B. J. Appl. Phys. 76 (1994) 6673
2. Grunes J., Zhu Z., Anderson E.A., and Somorjai G.A. J. Phys. Chem., B 106 (2002) 11463
3. Chen M.-S., Dulcey C.S., Brandow S.L., Leonard D.N., Dressick W.J., Calvert J.M., and Sims C.W. J. Electrochem. Soc. 147 (2000) 2607
4. Brandow S.L., Chen M.-S., Fertig S.J., Chrisey L.A., Dulcey C.S., and Dressick W.J. Chem. Eur. J. 7 (2001) 4495
5. Martensson T., Carlberg P., Borgstrom M., Montelius L., Seifert W., and Samuelson L. Nano Lett. 4 (2004) 699
6. Yan X.M., Kwon S., Contreras A.M., Bokor J., and Somorjai G.A. Nano Lett. 5 (2005) 745
7. Cherniavskaya O., Adzic A., Knutson C., Gross B.J., Zang L., Liu R., and Adams D.M. Langmuir 18 (2002) 7029
8. Guo Q., Teng X., Rahman S., and Yang H. J. Am. Chem. Soc. 125 (2003) 630
9. Ormonde A.D., Hicks E.C.M., Castillo J., and Van Duyne R.P. Langmuir 20 (2004) 6927
10. Bullen H.A., and Garrett S.J. Nano Lett. 2 (2002) 739
11. Hsu J.W.P., Tian Z.R., Simmons N.C., Matzke C.M., Voigt J.A., and Liu J. Nano Lett. 5 (2005) 83
12. Sugimura H., Hanji T., Takao O., Masuda T., and Misawa H. Electrochem. Acta 47 (2001) 103
13. Dressick W.J., Chen M.-S., and Brandow S.L. J. Am. Chem. Soc. 122 (2000) 982
14. Saito N., Haneda H., Sekiguchi T., Ohashi N., Sakaguchi I., and Koumoto K. Adv. Mater. 14 (2002) 418
15. Horiuchi S., Sarwar I.M., and Nakao Y. Adv. Mater. 12 (2000) 1507
16. Horiuchi S., Fujita T., Hayakawa T., and Nakao Y. Langmuir 7 (2003) 2963
17. Horiuchi S., Fujita T., Hayakawa T., and Nakao Y. Adv. Mater. 15 (2003) 1449
18. Yin D., Horiuchi S., and Masuoka T. Chem. Mater. 17 (2005) 463
19. Yin D., Horiuchi S., Morita M., and Takahara A. Langmuir 21 (2005) 9352
20. Lee J.Y., Yin D., and Horiuchi S. Chem. Mater. 17 (2005) 5498
21. Mallory G.O., and Hajdu J.B. Electroless Plating: Fundamentals and Application (1990), American Electroplaters and Surface Finishers Society, Orland FL
22. Watanabe T. Nano-Plating (2004), Elsevier, Amsterdam 666
23. Bozzini B., Sidorov V.E., Dovgopol A.S., and Birukov J.P. Int. J. Inorg. Mater. 2 (2000) 437
24. Chen M.-S., Brandow S.L., and Dressick W.J. Thin Solid Films 379 (2000) 203
25. Chen M.-S., Brandow S.L., Dulcey C.S., Dressick W.J., Taylor G.N., Bohland J.F., Georger Jr. J.H., Pavelchek E.K., and Calvert J.M. J. Electrochem. Soc. 146 (1999) 1421