Effect of mechanical process parameters on chemical mechanical polishing of Al thin films

Microelectronic Engineering

Volumn 65, Issue 1-2, 2002, Pages 13-23

  Cho, Woong ^a   Ahn, Yoomin ^b   Baek, Chang Wook ^c   Kim, Yong Kweon ^c  

^a Hanyang University   (South Korea)

^b Hanyang University   (South Korea)

^c Seoul National University   (South Korea)

Author keywords

Aluminum thin film; Chemical mechanical polishing; Mechanical process parameter

Indexed keywords

ABRASIVES; ALUMINA; CHEMICAL MECHANICAL POLISHING; SLURRIES; SURFACE ROUGHNESS;

MECHANICAL PROCESS PARAMETERS;

THIN FILMS;

EID: 0036891819     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00726-8     Document Type: Article

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