SCOPUS 정보 검색 플랫폼

Volumn 77, Issue 2, 2005, Pages 132-138

Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process

Author keywords

Chemical mechanical polishing (CMP); Oxidant; Passivation layer; Polishing selectivity

Indexed keywords

ADDITIVES; ADHESION; DIELECTRIC MATERIALS; ETCHING; OXIDATION; PASSIVATION; TUNGSTEN;

INTER-METAL DIELECTRIC (IMD); OXIDANTS; PASSIVATION LAYERS; POLISHING SELECTIVITY;

CHEMICAL MECHANICAL POLISHING;

EID: 12444271052 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2004.10.003 Document Type: Article

Times cited : (23)

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