Gap-reduced thermal paste package design for cooling single flip-chip electronic modules

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 651-657

  Sikka, K K ^a   Toy, H T ^a   Edwards, D L ^a   Iruvanti, S ^a   Ingalls, E M ^a   DeHaven, P W ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Assembly; Conducting materials; Electronic packaging thermal management; Electronics cooling; Inorganic materials; Sealing materials; Seals; Thermal conductivity; Thermal loading; Thermal resistance

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; COOLING; DESIGN; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT RESISTANCE; SEALANTS; SEALING (CLOSING); SEALS; STRUCTURAL DESIGN; THERMAL CONDUCTIVITY;

CONDUCTING MATERIALS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; ELECTRONICS COOLING; INORGANIC MATERIALS; THERMAL LOADINGS;

ELECTRONIC COOLING;

EID: 28144442389     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012516     Document Type: Conference Paper

References (5)

1. "Thermal modeling of grease-type interface material in PPGA application," C.-P. Chiu, G. L. Solbrekken and Y. D. Chung, 13th Annual Semiconductor Thermal Measurement & Management Symposium, SEMI-THERM, 1997, pp. 57-63.
2. "Understanding the Performance Characteristics of Phase-Change Thermal Interface Materials," B. Rauch, Intersociety Conference on Thermal Phenomena in Electronic Systems, ITHERM 2000, Las Vegas, NV, Vol. I, pp. 42-47.
3. "Heat Spreader Attach: A Microprocessor Thermal Solution," O. Starr, R. N. Master, M. Z. Khan, A. Tain and D. H. Ding, A. Juwanda, 49th Electronic Components and Technology Conference, 1999, pp. 238-242.
4. "Flip-Chip Package with a Heat Spreader for High-Power Dissipation LSI Chips," H. Ando, H. Kikuchi and T. Sato, 49th Electronic Components and Technology Conference, 1999, pp. 227-231.
5. "Advanced Thermal Tester for Accurate Measurement of the Internal Thermal Resistance of High Power Electronic Modules," K. K. Sikka, Intersociety Conference on Thermal Phenomena in Electronic Systems, ITHERM 2000, Las Vegas, NV, Vol. II, 208-212. Accepted for publication in the IEEE Transactions on Components, Manufacturing and Packaging Technology.