Morphology and thermal stability of Ti-doped copper nitride films

Journal of Physics D: Applied Physics

Volumn 40, Issue 11, 2007, Pages 3430-3435

  Fan, Xiaoyan ^a   Wu, Zhiguo ^a   Li, Huajun ^a   Geng, Baisong ^a   Li, Chun ^a   Yan, Pengxun ^a,b  

^a LANZHOU UNIVERSITY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MAGNETRON SPUTTERING; NITRIDES; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY;

COLUMNAR GRAINS SIZE; COPPER NITRIDE; CYLINDRICAL MAGNETRON SPUTTERING;

THIN FILMS;

EID: 34249304443     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/40/11/025     Document Type: Article

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