Copper nitride thin films prepared by the RF plasma chemical reactor with low pressure supersonic single and multi-plasma jet system

Surface and Coatings Technology

Volumn 116-119, Issue , 1999, Pages 321-326

  Soukup, L ^a   Sicha M ^a,b   Fendrych, F ^a   Jastrabik L ^a   Hubicka Z ^a,b   Chvostova D ^a   Sichova H ^b   Valvoda, V ^b   Tarasenko, A ^a   Studnicka V ^a   Wagner, T ^c   Novak M ^a  

^a INSTITUTE OF PHYSICS   (Czech Republic)

^b CHARLES UNIVERSITY   (Czech Republic)

^c LOT Laser Optik Technol ORIEL G   (Germany)

Author keywords

Copper nitride; Ellipsometry; Plasma chemical deposition; Plasma chemical reactor; Stoichiometry; Structure

Indexed keywords

CHEMICAL REACTORS; COPPER COMPOUNDS; ELLIPSOMETRY; ENERGY GAP; MICROHARDNESS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA JETS; STOICHIOMETRY; THIN FILMS;

COPPER NITRIDE; SUPERSONIC PLASMA JET SYSTEM;

OPTICAL FILMS;

EID: 0033334771     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00129-2     Document Type: Article

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