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Volumn 99, Issue 3, 2006, Pages 744-755
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Surface modification of polyimide films by argon plasma for copper metallization on microelectronic flex substrates
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Author keywords
Adhesion; Argon plasma; Atomic force miscroscopy (AFM); ESCA XPS; Surface modification
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Indexed keywords
ARGON;
METALLIZING;
PLASMAS;
STRENGTH OF MATERIALS;
SURFACE TREATMENT;
ARGON PLASMA;
ELECTRON SPECTROSCOPY FOR CHEMICAL ANALYSIS (ESCA);
ESCA/XPS;
POLYIMIDE FILMS;
PLASTIC FILMS;
FILM;
METALLIZATION;
POLYIMIDE;
SUBSTRATE;
SURFACE MODIFICATION;
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EID: 33645137323
PISSN: 00218995
EISSN: 10974628
Source Type: Journal
DOI: 10.1002/app.22545 Document Type: Article |
Times cited : (31)
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References (16)
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