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Volumn 99, Issue 3, 2006, Pages 744-755

Surface modification of polyimide films by argon plasma for copper metallization on microelectronic flex substrates

Author keywords

Adhesion; Argon plasma; Atomic force miscroscopy (AFM); ESCA XPS; Surface modification

Indexed keywords

ARGON; METALLIZING; PLASMAS; STRENGTH OF MATERIALS; SURFACE TREATMENT;

EID: 33645137323     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.22545     Document Type: Article
Times cited : (31)

References (16)
  • 10
    • 0001960254 scopus 로고
    • Plenum: New York, Chapter 13
    • Baglin, J. Fundamentals of Adhesion; Plenum: New York, 1991; Chapter 13, pp 363-382.
    • (1991) Fundamentals of Adhesion , pp. 363-382
    • Baglin, J.1
  • 16
    • 33645167557 scopus 로고    scopus 로고
    • Ph.D. Dissertation, University of Missouri-Columbia
    • Lin, Y.-S. Ph.D. Dissertation, University of Missouri-Columbia, 1996; p 200.
    • (1996) , pp. 200
    • Lin, Y.-S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.