Influences of pH and concentration of surfactant on the electrokinetic behavior of a nano-ceria slurry in shallow trench isolation chemical mechanical polishing

Journal of the Korean Physical Society

Volumn 47, Issue 4, 2005, Pages 705-711

  Kang, Hyun Goo ^a   Katoh, Takeo ^a   Park, Jea Gun ^a   Paik, Ungyu ^a   Park, Hyung Soon ^b  

^a Hanyang University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Ceria; CMP; pH; Removal rate; Shallow trench isolation; Slurry; Surfactant concentration

Indexed keywords

EID: 27844482153     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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