W-CMP for sub-micron inverse metallisation

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 241-248

  Van Kranenburg, Herma ^a   Van Corbach, Herman D ^a   Woerlee, Pierre H ^a   Lohmeier, Martin ^a,b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041163674     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00050-0     Document Type: Article

References (8)

1. F.B. Kaufman et al., J. Electrochem. Soc. 138 (1991) 3460.
2. Chin-Wen Liu et al., Proc. 1996 CMP-MIC Conference (1996) 138.
3. P. Burke, Proc. VLSI Multilevel Interconnect Conference (1991) 379.
4. S. Sivaram et al., Mat. Res. Soc. Symp. 260 (1992) 511.
5. M. Weling et al., Proc. 1996 CMP-MIC Conference (1996) 40.
6. H. Landis et al., Thin Solid Films 220 (1992) 1.
7. M. Rutten et al., Proc. VLSI Multilevel Interconnect Conference (1995) 491.
8. V. Blaschke et al., Proc. 1996 CMP-MIC Conference (1996) 124.