Effects of mixed abrasive slurry in oxide-chemical mechanical polishing

Journal of the Korean Physical Society

Volumn 45, Issue SUPPL., 2004, Pages

  Seo, Yong Jin ^a   Lee, Woo Sun ^b  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

Author keywords

Chemical mechanical polishing (CMP); Mixed abrasive slurry (MAS); Particle agglomeration

Indexed keywords

EID: 12744250281     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (11)

1. W. J. Patrick, J. Electrochem. Soc. 138, 555 (1991).
2. J. M. Steiferwald, S. P. Murarka and R. J. Getmann, Chemical Mechanical Planarization of Microelectronic Materials, (John Wiley & Sons, New York, 1997).
3. S. Y. Kim, S. Y. Jeong and Y. J. Seo, J. Mater. Sci.: Mater. Electron. 13, 299 (2002).
4. Y. J. Seo, S. W. park, C. B. Kim, S. Y. Kim, W. S. Lee and J. S. Park, J. Korean Phys. Soc. 42, S421 (2003).
5. Y. J. Seo, S. Y. Kim, J. S. Park and W. S. Lee, J. Korean Phys. Soc. 43, 798 (2003).
6. J. Y. Kim, S. K. Kim, U. Paik, T. Katoh and J. G. Park, J. Korean Phys. Soc. 41, 413 (2002).
7. K. J. Lee, W. S. Lee, C. J. Park, S. Y. Kim, J. S. Park and Y. J. Seo, in Proceedings of Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (Marina Del Rey, CA, USA, 2003), p. 403.
8. J. Luo and D. Dorfeld, in Proceedings of VLSI Multilevel Interconnection Conference (Santa Clara, CA, USA, 2001), p. 281.
9. A. Jindal, S. Hegde and S. V. Babu, Electrochemical and Solid-State Letters, 5, G48 (2002).
10. T. Hara, T. Tomisawa, T. Kurosu and T. Doy, J. Electrochemical Soc. 146, 2333 (1999).
11. T. Hara, T. Kurosu and T. Doy, Electrochemical and Solid-State Letters, 4, G109 (2001).