Wafer-level microelectromechanical system structural material test by electrical signal before pull-in

Applied Physics Letters

Volumn 90, Issue 12, 2007, Pages

  Hu, Yuh Chung ^a   Huang, Po Yuan ^a  

^a HUAFAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; ELASTIC MODULI; INTEGRATED CIRCUITS; MATERIALS TESTING; PICKUPS; RESIDUAL STRESSES;

MICRODEVICE MANUFACTURE; MICROTEST BEAMS; PICKUP SIGNALS; WAFER LEVEL TESTING;

MEMS;

EID: 33947594538     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2714998     Document Type: Article

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