Stresses in electroless Ni-P films for electronic packaging applications

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 169-173

  Jeon, Young Doo ^b   Paik, Kyung Wook ^a,b  

^a IEEE

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Coefficient of thermal expansion; Electroless Ni; Extrinsic stress; Flip chip; Intrinsic stress; Phosphorus content; Stoney equation; UBM

Indexed keywords

ELECTROLESS PLATING; FLIP CHIP DEVICES; LASER APPLICATIONS; METALLIC FILMS; METALLURGY; NICKEL; PH EFFECTS; PHOSPHORUS; SILICON WAFERS; STRESS ANALYSIS; SUBSTRATES; TENSILE STRESS; THERMAL EXPANSION;

UNDER BUMP METALLURGY (UBM);

ELECTRONICS PACKAGING;

EID: 0036506031     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991190     Document Type: Article

References (18)

1. Flip chip assembly using the gold, gold-tin and nickel-gold metallurgy
2. Electroless nickel/copper plating as a new bump metallization
3. Residual stresses in electrodeposits of nickel and nickel-iron alloy
4. Mechanical properties of thin films
5. The relationship between stress and adhesion of electroless Ni-P deposits on zincated Al
6. Mechanical stress as a function of temperature in aluminum films
7. Mechanical stress as a function of temperature for aluminum alloy films
8. The multilayer-modified Stoney's formula for laminated polymer composites on a silicon substrate
9. Comparison of some mechanical and corrosion properties of electroless and electroplated Ni-P alloys
10. Measurement and interpretation of stress in Al-based metallization as a function of thermal history