Revisiting micro hot-embossing with moulds in non-conventional materials

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 475-481

  Khan Malek, Chantal ^a   Coudevylle, Jean René ^a   Jeannot, Jean Claude ^a   Duffait, Roland ^b  

^a FEMTO ST INSTITUTE   (France)

^b Centre de Transfert en Micro et Nanotechnologies (CTMN)   (France)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; REACTIVE ION ETCHING; SILICON;

EMBOSSING TOOLS; MICRO HOT-EMBOSSING; NON-METALLIC TOOLING;

MOLDS;

EID: 33847270109     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0184-1     Document Type: Article

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