CMUTs and electronics for 2D and 3D imaging: Monolithic integration, in-handle chip sets and system implications

Proceedings - IEEE Ultrasonics Symposium

Volumn 1, Issue , 2005, Pages 463-474

  Daft, Chris ^a   Wagner, Paul ^a   Bymaster, Brett ^a   Panda, Satchi ^a   Patel, Kirti ^a   Ladabaum, Igal ^a  

^a SIEMENS CORPORATE RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITIVE MICROFABRICATED ULTRASOUND TRANSDUCERS (CMUT); CHIP SETS; MATRIX TRANSDUCER; MONOLITHIC INTEGRATION;

MICROELECTROMECHANICAL DEVICES; SIGNAL PROCESSING; THREE DIMENSIONAL; TRANSDUCERS; TWO DIMENSIONAL;

IMAGING TECHNIQUES;

EID: 33847116793     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2005.1602893     Document Type: Conference Paper

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