Growth behavior of electroless copper on silicon substrate

Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)

Volumn 14, Issue 1, 2007, Pages 67-71

  Wu, Shin Shyan ^a   Liu, Wei Long ^a   Tsai, Ting Kan ^a   Hsieh, Shu Huei ^a   Chen, Wen Jauh ^b  

^a Formosa University   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

activation energy; electroless copper; growth mechanism; silicon substrate

Indexed keywords

ACTIVATION ENERGY; COPPER; ELECTROLESS PLATING; SCANNING ELECTRON MICROSCOPY; SILICON; TRANSMISSION ELECTRON MICROSCOPY;

ELECTROLESS COPPER; GROWTH MECHANISM; SILICON SUBSTRATE;

GROWTH (MATERIALS);

EID: 33846887202     PISSN: 10058850     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-8850(07)60014-0     Document Type: Article

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