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IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 285-292

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

(3) Lau, John H a,b Chang, Chris a,c Lee, S W Ricky a,d

a IEEE (United States)

b AGILENT TECHNOLOGIES (United States)

c Express Packaging Systems Inc (United States)

d HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Hong Kong)

Author keywords

Flip chip; Solder joint reliability; WLCSP

Indexed keywords

THERMAL FATIGUE;

CRACK PROPAGATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRESS INTENSITY FACTORS; THERMAL CYCLING;

CHIP SCALE PACKAGES;

EID: 0035364232 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/6144.926395 Document Type: Article

Times cited : (31)

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