Experimental correlations of an energy-based fatigue life prediction method for solder joints

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1567-1570

  Akay, Hasan U ^a   Zhang, Hongyan ^a   Paydar, Nasser H ^a  

^a Indiana University Purdue University Indianapolis   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0141895198     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)

1. Akay, H. U., Paydar, N. H., and Bilgic, A., 1997a, "Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique," ASME Journal of Electronic Packaging (accepted for publication).
2. Akay, H. U., Bilgic, A., Zhang, H., and Paydar, N. H., 1997b, "Combined Heat Transfer and Thermal Stress Analysis for Fatigue Life Prediction of Solder Joints of Resistors," Proceedings of TMS Symposium on Design and Reliability of Solder Interconnects, Orlando, Florida, pp. 187-195.
3. Bilgic, A., 1996, "Fatigue Life Prediction Methods for Thermally Loaded Solder Joints Using the Finite Element Method," Master of Science Thesis, Purdue University.
4. Dasgupta, A., Oyan, C., Barker, D., and Pecht, M., 1992, "Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach," ASME Journal of Electronic Packaging, Vol. 114, pp. 152-160.
5. Engelmaier, W., 1983, "Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling," IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT-6, No.3, pp. 232-237.
6. Ishikawa, H., Sasaki, K., Ohguchi, K., 1996, " Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity," ASME Journal of Electronic Packaging, Vol. 118, pp. 164-169.
7. Lam, S. T., Arieli, A., and Mukherjee, A. K., 1979, "Superplastic Behavior of Pb-Sn Eutectic Alloy," Materials Science and Engineering, Vol. 40, pp. 73-79.
8. Lau, J., Golwalkar, S., Erasmus, S., Suratt, R., and Boysan, P., 1992, "Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability," ASME Journal of Electronic Packaging, Vol. 114, pp. 118-121.
9. Mohamed, F. A., and Langdon, T. G., 1976, "Deformation Mechanism Maps for Superplastic Materials," Scripta Metallurgica, Vol. 10, pp. 759-762.
10. Solomon, H. D., and Tolksdorf, E. D., 1995, "Energy Approach to the Fatigue of 60/40 Solder: Part 1 - Influence of Temperature and Cycle Frequency," ASME Journal of Electronic Packaging, Vol. 117, pp. 130-135.
11. Solomon, H. D., and Tolksdorf, E. D., 1996, "Energy Approach to the Fatigue of 60/40 Solder: Part 2 - Influence of Temperature and Cycle Frequency," ASME Journal of Electronic Packaging, Vol. 118, pp. 67-71.
12. Wen, L. C., Mon, G. R., and Ross, R. G., Jr., 1994, "Reliability Assessment of Solder Joints on LCCC Packages," Report No. JP D-11920, Jet Propulsion Laboratory.