Flip chip assembly on PCB substrates with coined solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 244-249

  Nah, Jae Woong ^a   Paik, Kyung W ^a   Cho, Soon Jin ^b   Kim, Won Hoe ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; FLIP CHIP DEVICES; MECHANICAL TESTING; MELTING; PRINTED CIRCUIT BOARDS; RELIABILITY; SUBSTRATES; TEMPERATURE; THERMAL CYCLING;

FLIP CHIP ASSEMBLY; FLIP CHIP BUMPING; HIGH MELTING TEMPERATURE; SOLDER BUMPS;

ELECTRONICS PACKAGING;

EID: 0037674970     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. John H. Lau, Flip Chip Technologies, McGraw-Hill (New York, 1996), pp. 123.
2. Mirng-Ji Lii et al, "Flip-Chip Technology on Organic Pin Grid Array Packages", Intel Technology Journal Q3, 2000
3. J.W. Nah, Kyung W. Paik, Won-Hoe Kim and Ki-Rok Hur, "Characterization of Coined Solder Bumps on PCB pads", Proc 52nd Electronic Components and Technology Conf, San Diego, CA, May. 2002, pp. 154-160.
4. A.J. Sunwoo et al, The growth of Cu-Sn intermetallic at a pretinned copper/solder interface, Metall. Trans., Vol. A23, No.4 (1992), pp. 1323-1332
5. C.-Y. Lee and K.-L. Lin, "The interaction kinetics and compound formation between electroless Ni-P and solder", Thin Solid Films, Vol. 249, No.2 (1994), pp. 201-206.
6. Y. Guo, S.-M. Kuo, and C. Zhang, "Reliability evaluations of under bump metallurgy in two solder systems", IEEE Trans. on CPT, Vol. 24, No.2 (2001), pp.655-660
7. K. Zeng, J.K. Kivilahti, "Use of muticomponent phase diagrams for predicting phase evolution in solder/conductor systems", J. Electron. Mater., Vol. 30, No.1 (2001) pp. 35-44
8. R.E. Pratt, E.I.Stromswold, D.J. Quesnel, "Effect of solid state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joint, IEEE Trans. CPMT-A, Vol. 19, No. 1 (1996), pp. 134-141.
9. T. B. Massalski, Binary Alloy Phase Diagram, 2nd ed., Vol. 2, 1986, pp. 1848
10. K.N.Tu et al., "Wetting reaction vs. solid state aging of eutectic SnPb on Cu", J. Appl. Phys., Vol. 8, No. 9 (2000), pp. 4843-4849