Lead-free solder: The Sn/Ag/Cu system

SMT Surface Mount Technology Magazine

Volumn 14, Issue 7, 2000, Pages 18-21

  Hwang, Jennie S ^a  

^a H Technologies Group Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003036727     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. H-Technologies Croup Inc. Internal Report Sn/Ag/Cu System, 1998.
2. Jennie S. Hwang, Lead-free Solder- Technology & Applications for Environmentally Friendly Manufacturing, Chapter 8, Electrochemical Publications, Great Britain, to be published Fall 2000.
3. Iver E. Anderson, Frederick G. Yost, John F. Smith, Chad M. Miller and Robert L. Terpstra, Iowa State University Research Foundation Inc. and Sandia Corp., "Pb-free Sn/Ag Ternary Eutectic," U.S. patent 5527628, June 18,1996.