A glass microfluidic chip adhesive bonding method at room temperature

Journal of Micromechanics and Microengineering

Volumn 16, Issue 12, 2006, Pages 2666-2672

  Pan, Yu Jen ^a   Yang, Ruey Jen ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHEMICAL RESISTANCE; EPOXY RESINS; GLASS BONDING; HIGH TEMPERATURE EFFECTS; LEAKAGE CURRENTS; ULTRAVIOLET RADIATION;

ELECTRICAL LEAKAGE; GLASS BLANKS; MICROFLUIDIC DEVICES; THERMAL FUSION PROCESS;

FLUIDICS;

EID: 33846060716     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/12/020     Document Type: Article

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