Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors

Journal of Micromechanics and Microengineering

Volumn 11, Issue 4, 2001, Pages 386-389

  Schlautmann, S ^a   Wensink, H ^a   Schasfoort, R ^a   Elwenspoek, M ^a   Van den Berg, A ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARITY; ELECTRIC CONDUCTIVITY; ELECTRODES; ELECTROPHORESIS; ETCHING; GLASS; SENSORS; THIN FILM DEVICES;

CONDUCTIVITY SENSORS; POWDER BLASTING;

FLUIDIC DEVICES;

EID: 0035392881     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/4/318     Document Type: Article

References (10)

1. 2000 High resolution powder blast micromachining
2. 2000 Powder blasting as a novel technique for the realisation of capillary electrophoresis chips
3. Field-effect flow control for microfabricated fluidic networks
4. Deep wet etching of fused silica glass for hollow capillary optical leaky waveguides in microfluidic devices
5. Development of novel low temperature bonding technologies for microchip chemical analysis applications
6. A novel technological process for glass-to-glass anodic bonding
7. The effect of surface roughness on direct wafer bonding
8. New approaches for fabrication of microfluidic capillary electrophoresis devices with on-chip conductivity detection