SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1138-1144

Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

(5) Lee, J H a Park, J H a Shin, D H b Lee, Y H a Kim, Y S a

a Hong Ik University (South Korea)

b Hanyang University (South Korea)

Author keywords

Aging treatment; Au containing ternary intermetallic; Au embrittlement; Fracture energy; Redeposition

Indexed keywords

AGING OF MATERIALS; DEPOSITION; ELECTRONIC STRUCTURE; EMBRITTLEMENT; GOLD; METALLURGY; MICROSTRUCTURE; REACTION KINETICS; SOLDERING ALLOYS; TERNARY SYSTEMS;

FRACTURE ENERGY; GOLD CONTAINING TERNARY INTERMETALLIC; GOLD EMBRITTLEMENT; REDEPOSITION; UNDER BUMP METALLURGY;

INTERMETALLICS;

EID: 0035455523 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-001-0141-9 Document Type: Article

Times cited : (22)

References (21)

1
- 0020125253
- (1982) Acta Metall. , vol.30 , pp. 947
- Tu, K.N.¹ Thompson, R.D.²

2
- 51249162222
- (1992) Metall. Trans. A , vol.23 A , pp. 857
- Mei, Z.¹ Sunwoo, A.J.² Morris, J.W.³

3
- 51649143798
- (1992) Metall. Trans. A , vol.23 A , pp. 1323
- Sunwoo, A.J.¹ Morris, J.W.² Lucey, G.K.³

4
- 0029223405
- (1995) Acta Metall. Mater. , vol.43 , pp. 329
- Bader, S.¹ Gust, W.² Hieber, H.³

5
- 11644253928
- ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom, (Warrendale, PA: TMS)
- (1997) Design & Reliability of Solders and Solder Interconnections , pp. 161
- Vianco, P.T.¹ Hopkins, P.L.² Erickson, K.L.³ Davidson, R.⁴

6
- 0031185622
- (1997) J. Electron. Mater. , vol.26 , pp. 883
- Flanders, D.R.¹ Jacobs, E.G.² Pinizzotto, R.F.³

7
- 0000019775
- ed. E. Suhir, M. Shiraton, and Y.C. Lee (New York: ASME)
- (1997) Advances in Electron. Pkg. , pp. 1347
- Pan, T.¹ Blair, H.D.² Nicholson, J.M.³ Oh, S.W.⁴

9
- 0033221504
- (1999) J. Electron. Mater. , vol.28 , pp. 1231
- Ho, C.E.¹ Chen, Y.M.² Kao, C.R.³

10
- 0033706198
- (2000) IEEE Trans. Comp. Pkg. Technol. , vol.23 , pp. 383
- Zribi, A.¹ Chromik, R.R.² Presthus, R.³ Teed, K.⁴ Zavalij, L.⁵ DeVita, J.⁶ Tova, J.⁷ Cotts, E.J.⁸ Clum, J.A.⁹ Erich, R.¹⁰ Primavera, A.¹¹ Westby, G.¹² Coyle, R.J.¹³ Wenger, G.M.¹⁴

11
- 0006681822
- Proc. 48th Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 1998) , pp. 952
- Mei, Z.¹ Kaufmaan, M.² Eslambolchi, A.³ Johnson, P.⁴

12
- 0033905004
- (2000) Metall. Trans. A , vol.31 A , pp. 798
- Minor, A.M.¹ Morris, J.W.²

13
- 0034293875
- (2000) J. Electron. Mater. , vol.29 , pp. 1170
- Minor, A.M.¹ Morris, J.W.²

14
- 0028543526
- (1994) IEEE Trans. Compon. Pkg. and Mfg. Technol. (Part B) , vol.17 , pp. 569
- Zakel, E.¹ Azdasht, G.² Reichl, H.³

15
- 0034295436
- (2000) J. Electron. Mater. , vol.29 , pp. 1175
- Ho, C.E.¹ Zheng, R.² Luo, G.L.³ Lin, A.H.⁴ Kao, C.R.⁵

16
- 0000709741
- (1961) J. Inst. Metals , vol.89 , pp. 218
- Ascoli, A.¹

17
- 36849115861
- (1966) J. Appl. Phys. , vol.37 , pp. 2375
- Dyson, B.F.¹

18
- 0342906506
- (2000) Scripta Mater. , vol.42 , pp. 827
- Lee, J.H.¹ Park, D.J.² Heo, J.N.³ Lee, Y.H.⁴ Shin, D.H.⁵ Kim, Y.S.⁶

19
- 0034297520
- (2000) J. Electron. Mater. , vol.29 , pp. 1264
- Lee, J.H.¹ Park, D.J.² Moon, J.T.³ Lee, Y.H.⁴ Shin, D.H.⁵ Kim, Y.S.⁶

20
- 85011862592
- (2000) J. Korean Inst. Met. & Mater. , vol.38 , pp. 1233
- Lee, J.H.¹ Park, D.J.² Lee, Y.H.³ Shin, D.H.⁴ Kim, Y.S.⁵

21
- 0031332168
- ed. R.K. Mahidhara, D.R. Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw, and W.L. Winterbottom (Warrendale, PA: TMS)
- (1997) Design & Reliability of Solders and Solder Interconnections , pp. 247
- Schaefer, M.¹ Laub, W.² Fournelle, R.A.³ Liang, J.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.