Thermal enhancement of systems using organic flip-chip packages (FC-PBGA) with an alternate cooling path through the printed wiring board

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 315-321

  Calmidi, Varaprasad ^a   Memis, Irv ^a  

^a Endicott Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC COLUMNS; DENSE CORE PACKAGES; GRID ARRAY PACKAGES; THERMAL IMPEDANCE;

BOUNDARY CONDITIONS; COMPUTER SIMULATION; COOLING; HEAT LOSSES; NUMERICAL ANALYSIS; PRINTED CIRCUIT BOARDS; SUBSTRATES; THERMAL EXPANSION;

FLIP CHIP DEVICES;

EID: 33845589289     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645665     Document Type: Conference Paper

References (13)

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