A numerical study of the thermal performance of a tape ball grid array (TBGA) package

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 329, Issue , 1996, Pages 83-89

  Sathe, Sanjeev B ^a   Sammakia, Bahgat G ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; NATURAL CONVECTION; NUMERICAL ANALYSIS; PARAMETER ESTIMATION; TEMPERATURE; THERMAL CONDUCTIVITY; THREE DIMENSIONAL; TURBULENCE;

RADIATION HEAT TRANSFER; TAPE BALL GRID ARRAY PACKAGE; THREE DIMENSIONAL MODEL; TURBULENCE MODEL;

PACKAGING MATERIALS;

EID: 4243160082     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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