Prediction of thermal performance of flip chip-plastic ball grid array (FC-PBGA) packages: Effect of substrate physical design

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 528-537

  Ramakrishna, K ^a   Lee, T Y T ^b  

^a MOTOROLA INC   (United States)

^b Advanced Interconnect Systems Lab   (United States)

Author keywords

Computational fluid dynamics; Conducting materials; Electronics packaging; Foot; Heat transfer; Plastic packaging; Resistance heating; Thermal conductivity; Thermal force; Thermal resistance

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; COMPUTATIONAL FLUID DYNAMICS; DESIGN; DIES; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; FLUID DYNAMICS; FORCED CONVECTION; HEAT CONVECTION; HEAT RESISTANCE; HEAT TRANSFER; SUBSTRATES; THERMAL CONDUCTIVITY OF LIQUIDS;

CONDUCTING MATERIALS; FOOT; PLASTIC PACKAGING; RESISTANCE-HEATING; THERMAL FORCES;

THERMAL CONDUCTIVITY;

EID: 50249132116     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012501     Document Type: Conference Paper

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