Thermal design of heat spreader and analysis of Thermal Interface Materials (TIM) for multi-chip package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1119-1123

  Pinjala, D ^a   Khan, Navas ^a   Ling, Xie ^a   Teo, Poi Siong ^a   Wong, E H ^a   Iyer, Mahadevan K ^a   Lee, Charles ^b   Rasiah, I J ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^c Honeywell Electronic Materials   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONIC EQUIPMENT MANUFACTURE; HEAT LOSSES; PRINTED CIRCUIT BOARDS;

THERMAL INTERFACE MATERIAL (TIM);

MULTICHIP MODULES;

EID: 0036294555     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008243     Document Type: Article

References (6)

1. An investigation on flip plastic BGA packages using CFD tool
2. Thermal design of pentium II xeon processor cartridge
3. Thermal simulation and validation of fast static RAM 164-lead FC-PBGA package with investigation of package thermal performance in generic CPU modules
4. Thermal interface selection methodology for high power dissipating multi-chip package