Thermal performance of a thin high interconnect density organic substrate for flip-chip applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1728-1734

  Calmidi, Varaprasad V ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLOW; ORGANIC SUBSTRATES; THERMAL PERFORMANCE;

HEAT CONDUCTION; HEAT SINKS; OPTICAL INTERCONNECTS; STIFFNESS; SUBSTRATES;

FLIP CHIP DEVICES;

EID: 24644447066     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. th ECTC Conference, Lake Buena Vista, FL, to appear
2. Memis, I., 2005, "Wireability Comparison of Flip Chip Substrates as a Function of Chip Design and Substrate Capability", 1st International Conference and Exhibition on Device Packaging, Scottsdale, AZ.
3. Ramakrishna, K., and Lee, T-Y.T, 2002, "Prediction of thermal performance of flip chip - Plastic Ball Grid Array (FC-PBGA) packages: Effect of substrate physical design", 8th ITERM conference, May 13-June 1, San Diego, CA
4. th International Symposium on Microelectronics, November 16-20, Boston, MA
5. Zhou, T., Hundt, M., 1996, "Board and system level effects on plastic package thermal performance", Proceedings of the 46th ECTC conference, pp 911-917
6. Sathe, S.B., and Sammakia, 1996, "A Numerical study of the thermal performance of a Tape Ball Grid Array (TBGA) package", 31st ASME National Heat Transfer Conference, HTD Vol 309, pp 83-94
7. Pinjala, D., Khan, N., Ling, X., Wong, E.H., Iyer, M.K., Lee, C., and Rasiah, I.J., 2002, "Thermal design of heat spreader and analysis of thermal interface materials for multi-chip package", Proceedings of the 52nd ECTC conference, pp 1119-1123
8. th ECTC Conference, Las Vegas, NV, 865-871
9. Ramakrishna, K., and Lee, T-Y.T, 2004, "Evaluation of Thermal Enhancements to Flip-Chip Ball Grid Array Packages", Transactions of ASME, Journal of Electronic Packaging, Vol. 129, pp. 449-456
10. Incropera, F.P., and Dewitt, D.P., 1990, Fundamentals of Heat and Mass Transfer, John Wiley, NewYork
11. Flomerics, 2004, FLOTHERM (TM) Version 5.1, Reference manual, Flomerics Ltd., U.K.
12. Calmidi, V.V, and Sathe, S.B., 2000, "Numerical analysis of buoyancy-induced flow and heat transfer in an enclosure with vents", ASME IMECE, HTD Vol.366-4, pp 407-420
13. th Intersociety Conference on Thermal and Thermo-mechanical Phenomena, SanDiego, CA, pp 618-625
14. EIA/JESD 51-9, 1999, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages", www.jedec.org
15. th ECTC Conference, Lake Buena Vista, FL, to appear