Flip chip assembly challenges using high density, thin core carriers

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 314-319

  Jadhav, Virendra ^a   Moore, Scott ^a   Palomaki, Cheryl ^a   Tran, Son ^a  

^a Endicott Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY MATERIALS; FLIP CHIP ASSEMBLY; PROCESS CONSTRAINTS; SIGNAL DENSITY;

ASSEMBLY; CONSTRAINT THEORY; OPTICAL INTERCONNECTS; PERFORMANCE; RELIABILITY; SENSITIVITY ANALYSIS;

FLIP CHIP DEVICES;

EID: 24644445711     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th Electronic Components and Technology Conf, Las Vegas, NV, May. 2004, pp. 1449-1453.
2. st International Conference and Exhibition on Device Packaging, Scottsdale, AZ, March 2005, to be published.
3. Banks, D., Gorrell R., Le-Huu Duy, Hanson D., and Qu Shichum, "A New, Thin High-Performance Organic Substrate" Circuit Assembly, January 2005.
4. Alcoe et. al. "A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier", July 1999 Semicon West