Large thin organic PTFE substrates for multichip applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1359-1363

  Nowak, Ron ^a   Hart, Paul ^a   Alcoe, Dave ^a  

^a Endicott Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SUBSTRATES; FLATNESS CONTROL; MULTICHIP APPLICATIONS;

ADHESIVES; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITORS; COMPUTER APPLICATIONS; DATA PROCESSING; DATA STORAGE EQUIPMENT; ELECTRIC CONDUCTIVITY; MICROPROCESSOR CHIPS; POLYTETRAFLUOROETHYLENES; SUBSTRATES; THERMAL CONDUCTIVITY;

COMPOSITE MATERIALS;

EID: 24644502815     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Alcoe, D., et al, "HyperBGA: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier," Publication of IBM Microelectronics, IBM MicroNews Vol. 6, No. 2 (2000), pp. 27-38.
2. Alcoe, D., Blackwell, K., Laine, E., "Flip Chip Packaging Advances," Advanced Packaging, June/July 2000, pp39-46.
3. Alcoe, D., Blackwell, K., Youngs, T., "Qualification Results of HyperBGA, IBM's High Performance Flip Chip Organic BGA Chip Carrier," Carrier," Publication of IBM Microelectronics, Semicon West Conference, San Jose, CA, July 2000.
4. Alcoe, D., "A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier," Ninth Meeting of The Symposium on Polymers for Microelectronics at Wintertour, Wilmington, Deleware, May 1-3 2000.
5. Xue, J., et al, "Evaluation of Manufacturing Assembly Process on Long Term Reliability of a High Performance ASIC Using Flip Chip HyperBGA Package," ECTC New Orleans, May 2003.
6. Alcoe, D., Blackwell, K., Rai, R., "High Reliability BGA Package Improvement on Module Total Cost of Ownership," IEE/SEMI Semicon West Conference, San Jose, CA, July 2003.
7. Blackwell, K., Carpenter, K,. "New Packaging Concept Provides Reliability," Advanced Packaging, July 2004, Cover.